Tvrdnu tusim len tie lacne akoze-strieborne.
Tvrdnu tusim len tie lacne akoze-strieborne.
1: Asus P2B 1.10 • Celeron 1100@1364/1.8V • 512MB SDRAM • Samsung SP1213N+WD AC28400 • Toshiba XM-6402B+SD-M1212 • PowerColor AR2L Radeon 9100 64MB • 3C900-Combo • Bt848A • ASB-3940UA • AWE-64 • DTK PTP-3007 • VisionMaster 405 • Umax UC630 • Star LC24-200 Colour 2: PCPartner TXB820DS • Cyrix MII PR300/1.8V • 256MB SDRAM • 2xSamsung HD400LD+IT8212F • Accesstek CW4001 • LS-120 • Mystique 4MB • Millennium II 4MB • 3C509 • CMI8329A+Dream MIDI • ADI ProVista E44 • SyncMaster 203B Notebook: DTK FortisPro TOP-5A • P166MMX/1.8V • 80MB EDO • Hitachi 5K80 40GB • 12,1" TFT Router: A-Trend ATC-1425B • i486DX 50@33/5V • 48MB FPM • WD AC14300 • UMC UM9003F • HP PC LAN 16/TP+ Car: Mazda 323P BA • Z5 1489ccm, 65kW@5500rpm, 134Nm@4000rpm
Jasne, ty stribrne jsou nejvetsi shi*ty... tyhle zatvrdnou, pokud jim poradne zatopis... a vysledny efekt je prakticky jen ten, ze mas jedro a stycnou plochu chladice zadrbanou od pastyPůvodně odeslal Rainbow
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MSI KT3 Ultra-ARU | AMD Athlon XP Thoroughbred 1800+@2600+ (1.65V) prime stable | CoolerMaster XDream III | Kingstone DDR400 512MB CL2.5 | GeForce 4MX 440 64MB | HITACHI 7K250 160GB 8MB PATA | LG GSA 4163B DVDRW + Toshiba SD-M1612 16x | Logitech MX1000 | Edimax EW7206APg | Realtek RTL8139/810x Fast Ethernet | Leadtek WinFast 2000XP deLuxe | EC Q3 Logic - LC-B350W PFC | Creative P580 | AOC 7K+
linux mandriva 2006 cz
Poculi ste nieco o tom, ze novsie, boxovane cpu od Intelu (napr. 640) maju medzi heatspreaderom a chladicom nejaku vrstvu (neviem z coho, silikon??), ktora nahradza pastuAlebo som nieco zle pochopil?
D925XECV2, I 640, 2x512 MB DDR2 Kingston 533, 80GB SATA Seagate, 160 GB ATA Seagate ST, 40 GB ATA Seagate IV , Teac DV-W58GA, Sapphire Radeon X1600XT 256MB, Iiyama ProLite x430s, 2x WinXP Pro CZ SP1 NTFS, 1x Win XP Pro CZ SP2 FAT32.
imho myslis tuto "zuvacku" , ale ta tusim bola snad na kazdom boxePůvodně odeslal Tykoxo
ever
Naposledy upravil -=HaDeS=-; 01.03.2006 v 00:58.
1)Damned CPU: 3930k@4.8Ghz HT ON; MoBo: Asus Rampage 4 Gene ; RAM: 16GB ; HDDs: Samsung PRO 256GB, VelociRaptor 300GB, WDC WD15EADS 1.5TB ; Graphic adapter: Asus GTX 580; Asus HD 5850
2)Mobile Dell XPS 1730 CPU: T8300 ; RAM: 4GB ; HDDs: 2x 160GB Graphic adapter: 8800 GTX SLI
Slave 1: i7 920@3.9GHz Slave 2: i7 920@3.7GHz, Slave 3: AMD 1055T@4GHz Slave 4: AMD 1055T@3.9GHz Slave 5: i7 930@3.9GHz Slave 6: i7 930@3.9HGz Slave 7: i7 920@3.8HGz
A staci to na seriozne chladenie? Mna presviedcali, ze na novsich Inteloch to uz spolahlivo nahradza pastu. Zase ma osuskali?
D925XECV2, I 640, 2x512 MB DDR2 Kingston 533, 80GB SATA Seagate, 160 GB ATA Seagate ST, 40 GB ATA Seagate IV , Teac DV-W58GA, Sapphire Radeon X1600XT 256MB, Iiyama ProLite x430s, 2x WinXP Pro CZ SP1 NTFS, 1x Win XP Pro CZ SP2 FAT32.
no zalezi co rozumies pod pojmom "seriozne chladenie" , pokial je "seriozne chladenie" to ze to uchladi 3ghz cpu na 3 ghz, tak ano je to v tom pridade "seriozne chladenie" , teda apson podla specifikacii. ked beries seriozne chadenie 3@4ghz pri 10 dB, tak tam to uz nesplna box, nie pastaPůvodně odeslal Tykoxo
Naposledy upravil -=HaDeS=-; 01.03.2006 v 02:53.
1)Damned CPU: 3930k@4.8Ghz HT ON; MoBo: Asus Rampage 4 Gene ; RAM: 16GB ; HDDs: Samsung PRO 256GB, VelociRaptor 300GB, WDC WD15EADS 1.5TB ; Graphic adapter: Asus GTX 580; Asus HD 5850
2)Mobile Dell XPS 1730 CPU: T8300 ; RAM: 4GB ; HDDs: 2x 160GB Graphic adapter: 8800 GTX SLI
Slave 1: i7 920@3.9GHz Slave 2: i7 920@3.7GHz, Slave 3: AMD 1055T@4GHz Slave 4: AMD 1055T@3.9GHz Slave 5: i7 930@3.9GHz Slave 6: i7 930@3.9HGz Slave 7: i7 920@3.8HGz
Takze zatial to bude stacit, kym to nebudem taktovat. Vdaka.
D925XECV2, I 640, 2x512 MB DDR2 Kingston 533, 80GB SATA Seagate, 160 GB ATA Seagate ST, 40 GB ATA Seagate IV , Teac DV-W58GA, Sapphire Radeon X1600XT 256MB, Iiyama ProLite x430s, 2x WinXP Pro CZ SP1 NTFS, 1x Win XP Pro CZ SP2 FAT32.
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