Zaujimave obrazky... -> 3Dfx
http://www.3dfxtuning.wz.cz/pic/daytona.jpg
Prvy obrazok je 3Dfx Daytona s pamatami DDR-2 a TVOUT
http://www.3dfxtuning.wz.cz/pic/rampage1.jpg
http://www.3dfxtuning.wz.cz/pic/rampage2.jpg
Dalsie su fotky prototipu RAMPAGE ktory sa uz nedozil uvedenia na trh...ale bol to fakt nadejny projekt
- nejake featurky RAMAGE prevzane z 3dfxzone.it:
0,18um productive process
Scalability similar to VSA 100
4 pipelines with 1pixel/1texel
200-250mhz Core clock
All the VSA 100 features plus:
Advanced T-buffer (probably the ability to perform 8 samples effects)
All the pixel shading functions supported by DX8.0
Hardware higher order surfaces or curved surfaces
Photorealisitic rendering
New texture combine modes
Ability to I give the quadtexturing
200 MHZ DDR memory
More Nothing is known about the rumored voxel unit and the supposed improved version of the FXT1 texture compression.
Nothing also about the Photoshop effects in hardware.
Features of the T&L unit (supposed Sage):
Very little in known about this except that it will be handle 75 million polygons and up to 25 lighing surces in hardware.
Obviously also the T&L unit will be SCALABLE such as the Rampage.
Configurations and scalability:
Also this new generation from 3dfx will be to fines chip solution. There to are three possible configurations:
Entry level 3DFX RAMPAGE configuration
Composed by 1 chip Rampage and 1 see T&L unit.As you the minimum is 2 Chips.
800Mpixel fill installments (Core clock at 200MHZ)
75 millions of polygons
6,4GB/sec memory bandwith
Middle level 3DFX RAMPAGE configuration
with 2 Rampage and 2 T&L unit. 4 Chips at all.
1,6Gigpixel fill installments (Core clock at 200MHZ)
150 millions of polygons
12,8Gb/sec memory bandwith
High-end 3DFX RAMPAGE configuration
(similar to the actual V5 6000) with 4 Rampage Chips and 4 T&L unit.
8 Chips at all for amzing specs!!....
3,2Gigapixels fill installments (Core clock at 200MHZ)
(GF2 kan to klare 0,8 - GF3 estimeres til 1,6) 300 millions polygons (GF2 kan to klare 25 mill., GF3 kan to klare 60 mill.)
25,6GB/sec memory bandwith (GF2 kan to klare 5,3)
The chip will be officially announced at ECTS in September. According to 3dfx it should be available in December (if everything goes for better...)
